3D Systems Packaging Research Center

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There is now a CONTENT FREEZE for Mercury while we switch to a new platform. It began on Friday, March 10 at 6pm and will end on Wednesday, March 15 at noon. No new content can be created during this time, but all material in the system as of the beginning of the freeze will be migrated to the new platform, including users and groups. Functionally the new site is identical to the old one. webteam@gatech.edu
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Group content

Title Type Status Created Name
NanoFANS Fall 2020 Series Session 2 | Pediatric & Point of Care Technology at Georgia Tech Event Published Mon, Oct 5, 2020 - 11:14am Christa Ernst
NanoFANS Fall 2020 Series Session 3 | Integrated Nanoplasmonic Biosensors for Protein Biomarkers Event Published Mon, Oct 5, 2020 - 11:31am Christa Ernst
Nano@Tech Virtual: Magnetic and Spintronic Device for Computing and Memory Event Published Tue, Jun 9, 2020 - 12:06pm Christa Ernst
3D Systems Packaging Research Center Virtual Distinguished Lecture | From Generative Neural Networks to Social Media Networks: Ascertaining the Veracity of Data in the Information Age Event Published Thu, Sep 3, 2020 - 11:27am Christa Ernst
Nano@Tech Virtual: Micro and Nano Technologies in 3D Tissue Bioprinting Event Published Tue, Jun 9, 2020 - 11:59am Christa Ernst
Southeastern Nanotechnology Infrastructure Corridor (SENIC) Program Receives NSF Renewal Grant News Published Mon, Aug 24, 2020 - 12:08pm Christa Ernst
New Flexible Electronics Research Shows Promise for Spinal Therapies News Published Fri, Aug 7, 2020 - 2:57pm Christa Ernst
Nano@Tech Virtual: Cross-layer Optimizations for Building Energy-Efficient 2.5D Systems with Silicon Photonic Networks Event Published Tue, Jun 9, 2020 - 11:54am Christa Ernst
SENIC Ambassadors Webinar Series: Toolbox for Nucleation and Crystal Growth at Single Entity Resolutions by Controlling Nanoscale Transport Event Published Wed, Jun 24, 2020 - 9:09am Christa Ernst
SENIC Ambassadors Webinar Series: Heat Transfer Across Length Scales – Focus on Thermal Management and Advanced Sensing Event Published Wed, Jun 24, 2020 - 8:49am Christa Ernst
SENIC Technical Webinar: In-situ heating experiments in TEM/STEMM Event Published Fri, May 29, 2020 - 1:28pm Christa Ernst
SENIC Technical Webinar: Fundamentals of Photomask Design Event Published Fri, May 29, 2020 - 1:16pm Christa Ernst
SENIC Technical Webinar: Wire-bonding Overview and Packaging Toolsets at Georgia Tech IEN Event Published Fri, May 29, 2020 - 1:09pm Christa Ernst
SENIC Technical Webinar: X-Ray Diffraction (XRD) for the Analysis of Thin Films Event Published Fri, May 29, 2020 - 12:52pm Christa Ernst
SENIC Technical Webinar Series: Session 2 -"Soft Lithography Methods of Fabrication" Event Published Tue, Apr 14, 2020 - 9:07pm Farlenthia Walker
SENIC Technical Webinar Series: Session 3 - Elionix ELS-G100 100 kV Electron Beam Lithography System – Enabling Nanotechnology Event Published Thu, Apr 16, 2020 - 3:59pm Farlenthia Walker
SENIC Technical Webinar Series: Session 4 - Photolithography at GT-IEN: An Overview of Processes and Equipment Event Published Mon, Apr 20, 2020 - 10:07am Farlenthia Walker
SENIC Technical Webinar Series: Session 5 - Laser Micromachining at GT-IEN Event Published Mon, Apr 20, 2020 - 12:28pm Farlenthia Walker
SENIC Technical Webinar Series: Session 6 - Etching at GT-IEN: A Review of Processes and Equipment Event Published Mon, Apr 20, 2020 - 12:46pm Farlenthia Walker
SENIC Technical Webinar Series: Session 1 - "Southeastern Nanotechnology Infrastructure Corridor (SENIC) – A Regional Research Resource Event Published Tue, Apr 14, 2020 - 6:21pm Farlenthia Walker

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Group media

Image Title Type Created Name
Figure 5. (b) composite metal foams Figure 5. (b) composite metal foams Image Friday, May 18, 2018 - 3:10pm cheath6
Figure 5. (a) Depiction of a power module that is mounted directly on the cooling system, utilizing gradient, and Figure 5. (a) Depiction of a power module that is mounted directly on the cooling system, utilizing gradient, and Image Friday, May 18, 2018 - 3:09pm cheath6
Figure 4.  All-Cu die-attach joints formed after densification of patterned nano-Cu foam films Figure 4. All-Cu die-attach joints formed after densification of patterned nano-Cu foam films Image Friday, May 18, 2018 - 2:34pm cheath6
Figure 2. (a) schematic of glass interposer package with copper structures and vapor chamber integrated in PCB Figure 2. (a) schematic of glass interposer package with copper structures and vapor chamber integrated in PCB Image Friday, May 18, 2018 - 2:06pm cheath6
Figure 2. (b) junction-to-board thermal resistance in 4 different study cases; and Figure 2. (b) junction-to-board thermal resistance in 4 different study cases; and Image Friday, May 18, 2018 - 2:11pm cheath6
Figure 2. (c) thermal resistance of PCB integrated with vapor chamber (total thickness 1 mm) vs. copper plated PCB (total thickness 1 mm) Figure 2. (c) thermal resistance of PCB integrated with vapor chamber (total thickness: ~ 1 mm) vs. copper plated PCB (total thickness: ~ 1 mm) Image Friday, May 18, 2018 - 2:18pm cheath6
Figure 1. New innovations in thermal management of high-density glass packages. Image Friday, May 18, 2018 - 2:01pm cheath6
Figure 1. New innovations in thermal management of high-density glass packages. Figure 1. New innovations in thermal management of high-density glass packages. Image Friday, May 18, 2018 - 1:46pm cheath6
Figure 6. First Ever 2.5D GPE package at 40um I/O pitch Image Friday, April 13, 2018 - 2:06pm cheath6
Figure 5. Ultra-Thin (200um) GPE Demo at GT Image Friday, April 13, 2018 - 2:01pm cheath6
Figure 4. First Demo of Si-Like RDL on Glass Panels Image Friday, April 13, 2018 - 1:53pm cheath6
Figure 2. High Precision and High Throughput Glass Cavities Figure 2. High Precision and High Throughput Glass Cavities Image Friday, April 13, 2018 - 1:18pm cheath6
Figure 3. First Demo of 40um I/O Pitch Embedding with <2um Die Shift Figure 3. First Demo of 40um I/O Pitch Embedding with <2um Die Shift Image Friday, April 13, 2018 - 1:31pm cheath6
Figure 2. High Precision and High Throughput Glass Cavities Figure 1. Glass Panel Embedded (GPE) packages with integrated TPVs. Image Friday, April 13, 2018 - 1:07pm cheath6
What is New in Packaging @ Georgia Tech? Undergrad Textbook on Device and Systems Packaging Image Tuesday, April 10, 2018 - 4:58pm cheath6
Georgia Tech and its Industry Partners Develop Via-in-Trench with Upto 10X Improvement in I/O Density: A Revolutionary Panel-based RDL Process Technology Capable of 200-450 I/O/mm/Layer Figure 1 Image Tuesday, April 10, 2018 - 10:51am cheath6
GT Steam Tower Spring 2018 ATL Campus Steam Tower Image Wednesday, April 4, 2018 - 9:09am Christa Ernst
5G Modules from large glass panels 5G Modules from large glass panels Image Friday, March 30, 2018 - 12:18pm cheath6
5G bandpass filters with ultra-small footprint on glass 5G bandpass filters with ultra-small footprint on glass Image Friday, March 30, 2018 - 12:18pm cheath6
22% bandwidth with 4.2 dBi gain with Yagi-Uda antennas on glass Image Friday, March 30, 2018 - 12:16pm cheath6

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