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There is now a CONTENT FREEZE for Mercury while we switch to a new platform. It began on Friday, March 10 at 6pm and will end on Wednesday, March 15 at noon. No new content can be created during this time, but all material in the system as of the beginning of the freeze will be migrated to the new platform, including users and groups. Functionally the new site is identical to the old one. webteam@gatech.edu
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Speaker: Christian Schuster
Affiliation: Hamburg University of Technology (Germany), Institute of Electromagnetic Theory
Topic: "Advancing the Electrical Integrity of Digital Systems"
Biography
Christian Schuster received the Diploma degree in physics from the University of Konstanz, Germany, in 1996, and the Ph. D. degree in electrical engineering from the Swiss Federal Institute of Technology (ETH), Zurich, Switzerland, in 2000. Since 2006, he has been a full professor and head of the Institute of Electromagnetic Theory at the Hamburg University of Technology (TUHH), Germany. Prior to that he was with the IBM T. J. Watson Research Center, Yorktown Heights, N.Y., where he was involved in high-speed optoelectronic package and backplane interconnect modeling and signal integrity design for new server generations.
Dr. Schuster received the IEEE Transactions on EMC Best Paper Award in 2001, IEC DesignCon Paper Awards in 2005 and 2006, three IBM Research Division Awards between 2003 and 2005, an award for the best interactive presentation at DATE-Europe in 2009, and an IBM Faculty Award in 2009. He is a senior member of the IEEE, a member of the German Physical Society, and a member of several technical program committees of international conferences on signal/power integrity and electromagnetic compatibility.
Abstract: "Advancing the Electrical Integrity of Digital Systems"
Dr. Schuster will present research done by his group at TUHH during recent years. Specifically, he will introduce a "physics-based" model for vertical interconnects, i.e. plated through holes (vias), that captures the salient features of signal propagation up to 20 GHz and beyond. Apart from the physical insight that these models offer they show a speed-up over traditional full-wave simulations by a factor of 1000 or more. In addition, techniques and procedures for accurate measurements of vias will be discussed. Measurement results will be compared with model results. Finally, applications of the via models to power integrity and electromagnetic compatibility problems will be addressed.
