ECE Ph.D. Candidate Receives Top Electronic Packaging Award

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Dan Watson
dwatson@ece.gatech.edu

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Summaries

Summary Sentence:

Yiliang Guo has received the Best Student Paper Award at the IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium.

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  • ECE Ph.D. candidate Yiliang Guo ECE Ph.D. candidate Yiliang Guo
    (image/jpeg)

Ph.D. candidate Yiliang Guo has received the Best Student Paper Award at the IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium.

Guo is a graduate researcher in Georgia Tech’s 3D Systems Packaging Research Center (PRC), a leading academic center focused on advanced packaging and system integration leading to System on Package (SoP) technologies. He is advised by former ECE Professor Madhavan Swaminathan, currently at the Penn State Department of Electrical Engineering.

Guo’s research interests include machine learning (ML) and optimization, and their applications in microwave design and electronic packaging problems. His award-winning paper, “Training Set Optimization with Uncertainty Quantification for Machine Learning Models of Electromagnetic Structures,” proposes to use the uncertainty quantification method to reduce the size of training sets required by ML models.

He recently received the Best Student Paper Award on a different research project at the 2022 Electrical Performance of Electronic Packaging and Systems Conference (EPEPS 2022).

The EDAPS symposium has consistently served as a platform for dissemination of latest research in the areas of electrical design of chip, package and system. The symposium consists of technical paper presentation, poster sessions, industry exhibits, workshops, and tutorials. The conference took place virtually December 12-14.

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School of Electrical and Computer Engineering

Categories
Institute and Campus, Student Research, Engineering, Nanotechnology and Nanoscience
Related Core Research Areas
Electronics and Nanotechnology
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Keywords
Yiliang Guo, IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 3D Systems Packaging Research Center (PRC)
Status
  • Created By: dwatson71
  • Workflow Status: Published
  • Created On: Jan 25, 2023 - 11:47am
  • Last Updated: Jan 26, 2023 - 10:40am