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There is now a CONTENT FREEZE for Mercury while we switch to a new platform. It began on Friday, March 10 at 6pm and will end on Wednesday, March 15 at noon. No new content can be created during this time, but all material in the system as of the beginning of the freeze will be migrated to the new platform, including users and groups. Functionally the new site is identical to the old one. webteam@gatech.edu
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Title: Power Delivery and Thermal-Aware Electronic Design Automation Solutions for High-Performance 3D ICs
Committee:
Dr. Lim, Advisor
Dr. Yu, Chair
Dr. Mukhopadhyay
Abstract: The objective of the proposed research is to implement EDA solutions to evaluate and mitigate power delivery and thermal challenges in 3D ICs with emerging high-density 3D interconnects and advanced technology nodes. Specifically, we plan to compare the power integrity of 3D ICs with different bonding pitches and propose strategies to improve their power delivery reliability accordingly, and then extend the solutions to advanced technology nodes beyond 3nm. Our potential methodologies include physical and electrical modeling of 3D interconnects, rapid design space explorations using early-stage analysis, and novel power delivery structures such as back-side power delivery.
