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Title: A Novel Heterogeneously Integrated Photonic Platform for Optical Interconnects
Committee:
Dr. Adibi, Advisor
Dr. Swaminathan, Chair
Dr. Klein
Abstract: The objective of the proposed research is to develop a heterogeneously integrated photonic platform for interconnect applications. The approach described in this proposal addresses heterogeneous integration through the culmination of three technologies, a) electro-photonic co-packaging, b) electro-photonic monolithic integration, and c) hybrid photonic platform using silicon carbide and lithium niobate. First, I present an on-package optical interconnect model, using polymer waveguide on glass interposer technology, while identifying the key design improvements needed for achieving the goal of low-energy consumption. The main purpose of the interconnect is to provide high-speed on-package data transfer which is conventionally limited by the electronic interconnects. Moving further, I discuss the advantages of monolithic electro-photonic integration in designing interconnect elements with specific focus on the thermal tuning mechanism of the ring resonator. Finally, I propose for the first time, a hybrid photonic platform by bonding silicon carbide and lithium niobate. The main purpose of this hybrid platform is to bring the unique photonic capabilities of silicon carbide and lithium niobate for addressing the speed-energy consumption challenges in future interconnects.
