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There is now a CONTENT FREEZE for Mercury while we switch to a new platform. It began on Friday, March 10 at 6pm and will end on Wednesday, March 15 at noon. No new content can be created during this time, but all material in the system as of the beginning of the freeze will be migrated to the new platform, including users and groups. Functionally the new site is identical to the old one. webteam@gatech.edu
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Featuring Ganesh Subbarayan, School of Mechanical Engineering, Purdue University
Abstract: Heterogeneous Integration provides a powerful and cost-effective means for building complex Systems-in-Package (SiPs). Recently, sophisticated examples of heterogeneously integrated packages containing nearly 50 dies, many fabricated by different vendors on different technological nodes, have been demonstrated. In general, integration of large number of dies leads to a polynomial increase in material interfaces, which are potential locations for increased thermal resistance and mechanical fracture. Also, the larger sized multi-dye packages result in complex chip-package interactions, while the smaller solder bump size results in joints that are largely made of brittle intermetallic compounds. In this talk, I will broadly describe the reliability concerns in heterogeneously integrated packages and illustrate through examples the thermo-mechanical behavioral characterization necessary for their reliability assessment. Specifically, I will describe (1) an assessment of stress induced by Through Silicon Vias (TSV) and its impact on mobility (2) the reasons for package-caused fracture in back-end-of-line (BEOL) structures (referred to as chip-package interaction) (3) the effect of thermal expansion mismatch between the mold compound and silicone on fracture in BEOL structures and (4) modeling and experimental characterization of phase growth under current and elevated temperature (electromigration) in microbumps. Underlying the examples are sophisticated multiphysics computational models for moving (crack or phase) boundaries as well as fabricated test devices.
Bio: Ganesh Subbarayan is a professor of mechanical engineering at Purdue University and the co-director of the Purdue-Binghamton SRC Center for Heterogeneous Integration Research in Packaging (CHIRP). He began his professional career at IBM Corporation (1990-93). He holds a B.Tech degree in mechanical engineering (1985) from the Indian Institute of Technology, Madras and Direct Ph.D. (1991) in mechanical engineering from Cornell University. Subbarayan’s research is broadly concerned with modeling and experimentally characterizing failure in microelectronic devices and assemblies. He was a pioneer in using geometric models directly for analysis, popularly referred to as Isogeometric Analysis. Among others, Subbarayan is a recipient of the 2005 Mechanics Award from the ASME EPP Division and the NSF CAREER award. He is a fellow of ASME as well as IEEE, and he served as the editor-in-chief of IEEE transactions on Advanced Packaging during 2002-10.
Please register in advance at: https://tinyurl.com/GTPRCSubbarayan22
