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Title: Design, Fabrication and Characterization of Sub-THz Components in Glass Interposer Substrates
Committee:
Dr. Swaminathan, Advisor
Dr. Peterson, Chair
Dr. Durgin
Abstract: The objective of the proposed research is to develop glass interposer technology for sub-THz frequency region. To achieve data rate in order of 100 Gbps for beyond 5G era, wide multi-gigabit physical bandwidth systems are essential, and these systems will require carrier frequencies above 100 GHz. Glass interposer technology is gaining attention for supporting these sub-THz modules because of its ability to fabricate fine features sizes at low cost with superior electrical performance. This work contributes to the development of glass interposer technology for the sub-THz frequency region by providing the first electrical characterization results (dielectric constant and loss tangent) for glass interposers for a broad frequency range of 20 GHz to 170 GHz. It also provides the performance of interconnects (microstrip lines, CPWs and SIWs) on glass substrates up to 170 GHz. This work also contributes to the development of glass based SIW technology by introducing blind via filters for making compact filters in SIW technology and air-cavity based glass interposers for ultra-low loss air-filled SIWs.
