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There is now a CONTENT FREEZE for Mercury while we switch to a new platform. It began on Friday, March 10 at 6pm and will end on Wednesday, March 15 at noon. No new content can be created during this time, but all material in the system as of the beginning of the freeze will be migrated to the new platform, including users and groups. Functionally the new site is identical to the old one. webteam@gatech.edu
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Title: Electronic Design Automation Solutions and Design Tradeoffs for Emerging Heterogeneous 2.5D and 3D ICs
Committee:
Dr. Lim, Advisor
Dr. Swaminathan, Chair
Dr. Mukhopadhyay
Abstract: The objectives of this proposed research span from addressing the shortcomings of 2D ICs including the scaling and the design complexity to design and CAD methodologies for emerging 2.5D and 3D integrations and observation on the design tradeoffs between technologies in each category. The proposed research includes 1) a vertically-integrated EDA flow for an interposer-based 2.5D IC design which covers and fully automates the whole design phases of architecture, circuit and package, 2) the tradeoff studies on various 2.5D integration options including power delivery scheme and interposer technologies, 3) the study on PPA and reliability tradeoffs between the state-of-the-art 3D integration technologies, 4) chiplet/interposer co-design flow for 2.5D PDN optimization, and 5) a test-aware monolithic 3D IC design methodology enabling the effective defect screening and quality assurance.
