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There is now a CONTENT FREEZE for Mercury while we switch to a new platform. It began on Friday, March 10 at 6pm and will end on Wednesday, March 15 at noon. No new content can be created during this time, but all material in the system as of the beginning of the freeze will be migrated to the new platform, including users and groups. Functionally the new site is identical to the old one. webteam@gatech.edu
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Atlanta, GA | Posted: September 22, 2010
Summary Sentence:
ECE Ph.D. student Hyung Suk Yang wins top honors at SRC TECHCON
Full Summary:
ECE Ph.D. student Hyung Suk (James) Yang received the Best in Session Award from Semiconductor Research Corporation Techcon 2010 for his presentation entitled "Marriage of CMOS and MEMS Using Flexible Interconnects and TSVs."
Hyuk Suk Yang with his Ph.D. advisor Muhannad BakiHyung Suk (James) Yang received the Best in Session Award from Semiconductor Research Corporation Techcon 2010 for his presentation entitled "Marriage of CMOS and MEMS Using Flexible Interconnects and TSVs." He is a graduate research assistant in the School of Electrical and Computer Engineering at Georgia Tech.
Mr. Yang presented his work at SRC Techcon 2010, held September 13-14 in Austin, Tex. and did a podcast on this work with his coauthor and Ph.D. advisor, Muhannad Bakir, an associate professor in ECE. Listen to the podcast.
Two key technologies that enable 3D integration of CMOS integrated circuits (IC) and MEMS are Mechanically Flexible Interconnects (MFIs) and Through-Silicon Vias. MFIs allow stress-free interconnections between chips, so that the MEMS device does not change behavior or experience performance degradation due to chip warpage. Through-Silicon Via (TSV), on the other hand, lets sensors face away from the CMOS IC, thereby allowing it to be exposed to various target materials. As a collective, these two interconnect technologies enable integration of an arbitrary MEMS technology with a state-of-the-art CMOS IC.
