*********************************
There is now a CONTENT FREEZE for Mercury while we switch to a new platform. It began on Friday, March 10 at 6pm and will end on Wednesday, March 15 at noon. No new content can be created during this time, but all material in the system as of the beginning of the freeze will be migrated to the new platform, including users and groups. Functionally the new site is identical to the old one. webteam@gatech.edu
*********************************
Title: Heterogeneous Integration of Chiplets Using Socketed Platforms, Off-Chip Flexible Interconnects, and Self-Alignment Technologies
Committee:
Dr. Muhannad Bakir, ECE, Chair , Advisor
Dr. Oliver Brand, ECE
Dr. Hua Wang, ECE
Dr. Adilson Cardoso, GTRI
Dr. Suresh Sitaraman, ME
Abstract: The heterogeneous integration of chiplets addresses many of the technical and logistical challenges associated with SoCs to meet the ever-increasing demands from a variety of emerging markets including IoT and mm-wave 5G. These integrated systems are conventionally permanently integrated/interconnected in a fixed configuration via either microbumps or other advanced off-chip interconnect technologies. However, some applications require the heterogeneity and fine-pitch provided by these multi-chiplet polylithic systems while also requiring a non-permanent or replaceable setup to meet a variety of needs or to enable a variety of applications: reworkability, testing, prototyping, upgradeability, etc. Furthermore, as systems integrate a growing number of chiplets, package/system yield can suffer considerably when in a permanent configuration; a replaceable setup can directly address this problem. To address the aforementioned challenges, this research presents novel, replaceable heterogeneously integrated systems using socketed platforms for different targeted applications. In general, such a system requires two enabling technologies: 1) a non-permanent off-chip interconnection system and 2) a non-permanent alignment technology. Hence, this research also introduces the design, fabrication, and characterization of off-chip flexible interconnects and mechanically-based self-alignment technologies.
