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There is now a CONTENT FREEZE for Mercury while we switch to a new platform. It began on Friday, March 10 at 6pm and will end on Wednesday, March 15 at noon. No new content can be created during this time, but all material in the system as of the beginning of the freeze will be migrated to the new platform, including users and groups. Functionally the new site is identical to the old one. webteam@gatech.edu
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Title: Ultra-dense 3D Heterogeneous Integration Interconnect and Assembly
Committee:
Dr. Bakir, Advisor
Dr. Brand, Chair
Dr. Frazier
Abstract: The objective of the proposed research contains two parts. The first part of the research is about developing ALD Co bonding to achieve a wafer-level batch-bonding process that has a sub-micron I/O pitch, a low bonding temperature, a low surface- treatment requirement, and the capability for multi-pitch/multi-diameter. The second part of the research use low-temperature PECVD Si/SiO2 to encapsulate multiple chiplets and form reconstituted wafer to achieve a high density, wafer-level, BEOL-integrated, multi-tier stacked 3D fan-out wafer-level package (FOWLP).
