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Title: Modeling, Design, Fabrication and Demonstration of Ultra-thin High-performance Glass Panel Embedded (GPE) Packages for mm-Wave Application
Committee:
Dr. Rao Tummala, ECE, Chair , Advisor
Dr. Andrew Peterson, ECE
Dr. Madhavan Swaminathan, ECE
Dr. Mohanalingam Kathaperumal, PRC
Dr. Eric Vogel, MSE
Abstract: The objective of the proposed research is to model, design, fabricate and demonstrate ultra-thin, high-performance ultra-thin glass panel embedded package (GPE) for mm-Wave applications. Ultra-thin low-warpage GPE packages were demonstrated with thickness less than 150 µm applying advanced low-cost large panel based double side carrier process. Low-loss interconnects were modeled and designed with interconnection loss below 0.12 dB at 77 GHz enabled by ultra-low loss dielectric, and high precision processing with minimal variations in line and via geometries on glass substrates. A die-package codesign was proposed for high-frequency characterization of ultra-thin GPE package for mm-Wave applications.
