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Atlanta, GA | Posted: May 5, 2020
Jackie Nemeth
School of Electrical and Computer Engineering
404-894-2906
Summary Sentence:
ECE Ph.D. student Siddharth Ravichandran has been chosen for the IEEE Electronics Packaging Society (EPS) Ph.D. Fellowship Award.
Full Summary:
ECE Ph.D. student Siddharth Ravichandran has been chosen for the IEEE Electronics Packaging Society (EPS) Ph.D. Fellowship Award.
Siddharth RavichandranSiddharth Ravichandran has been chosen for the IEEE Electronics Packaging Society (EPS) Ph.D. Fellowship Award. He is a third-year Ph.D. student in the Georgia Tech School of Electrical and Computer Engineering (ECE) and is advised by ECE Professor Emeritus Rao Tummala.
This fellowship is given to an exceptional student pursuing a doctorate degree within the IEEE EPS technical field. Ravichandran will be recognized in person for this award during the 2021 IEEE Electronic Components Technology Conference (ECTC), to be held June 1-4, 2021 in San Diego, California, since this year’s conference is being held in a virtual format.
Ravichandran received this award for demonstrating exceptional ability to perform independent research in the field of electronic packaging and for his contributions to the development of 3D Glass Panel Embedded (GPE) Packages with superior bandwidth than with silicon interposers for ultra-high bandwidth in high-performance computing (HPC).
With the slowing down of Moore's law scaling, HPC systems today pursue heterogeneous integration of processor cores and memory chips on the same package. Hence, the bandwidth and power efficiency of chip-to-chip communication becomes the limiting factor in scaling system performance. Ravichandran’s research is on designing and demonstrating a novel 3D packaging architecture using glass-based panel embedding to achieve superior bandwidth and power efficiency than the current state-of-the-art silicon interposer packages in a low-cost and thermo-mechanically reliable fashion.
Apart from high-performance computing, Ravichandran is also interested in extending his research to other applications, including 5G and mm-wave packaging. He has received several other recognitions for his work. Ravichandran won the IEEE EPS Packaging Vision contest in 2019 and was invited to present at the plenary session of the IEEE ECTC, held in Las Vegas, Nevada in 2019. He also won the best paper award at the 2018 IMAPS International Symposium on Microelectronics, held in Pasadena, California.
Ravichandran started his Ph.D program in ECE at Georgia Tech in 2017. He received his master's in ECE from Rutgers University in 2016 and his bachelor's in ECE from the College of Engineering - Guindy, located in Chennai, India, in 2013.
