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Title: Dense interconnection and advanced thermal management solutions for 2.5D and 3D heterogeneous integrated devices
Committee:
Dr. Bakir, Advisor
Dr. May, Co-Advisor
Dr. Frazier, Chair
Dr. Cressler
Abstract:
The object of the proposed research is to design and demonstrate advanced interconnection and thermal management solutions for 2.5D and 3D heterogeneous ICs. Modern compute workloads require hardware capabilities which cannot be provided by the ever-slowing transistor scaling. This has driven the recent surge towards heterogeneous integration, where advanced 2.5D and 3D ICs complement System-on-Chip (SoC) innovations to provide high performance, low cost, and more customizable System-in-Packages (SiPs). In this work, we present two key enabling technologies for SiP scaling. First, we discuss a new interconnect platform that uses mechanical self-alignment in conjunction with metal electroless deposition as a method to facilitate low temperature, low pressure, and high interconnect density inter-die bonding in heterogeneous 2.5D and 3D ICs. This method is a highly scalable alternative to the conventional solder-based interconnects but comes without the stringent requirements like including high temperature tolerance, high pressure process, extreme surface planarity and cleanliness, and very accurate initial alignment requirements of Cu-Cu direct bonding. Secondly, we present the use of embedded microfluidic cooling as a thermal management solution for 2.5D ICs. A 3D printed manifold is used for fluid delivery to multiple dice simultaneously. We show benefits in terms of managing higher aggregate package power, as well as minimizing the thermal coupling between closely spaced dice in 2.5D SiPs.
