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There is now a CONTENT FREEZE for Mercury while we switch to a new platform. It began on Friday, March 10 at 6pm and will end on Wednesday, March 15 at noon. No new content can be created during this time, but all material in the system as of the beginning of the freeze will be migrated to the new platform, including users and groups. Functionally the new site is identical to the old one. webteam@gatech.edu
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Atlanta, GA | Posted: January 8, 2019
Jackie Nemeth
School of Electrical and Computer Engineering
404-894-2906
Summary Sentence:
ECE Ph.D. student Siddharth Ravichandran won the Best Student Paper Award at the 51st International Symposium on Microelectronics (IMAPS), held October 9-11, 2018 in Pasadena, California.
Full Summary:
ECE Ph.D. student Siddharth Ravichandran won the Best Student Paper Award at the 51st International Symposium on Microelectronics (IMAPS), held October 9-11, 2018 in Pasadena, California.
Siddharth RavichandranSiddharth Ravichandran won the Best Student Paper Award at the 51st International Symposium on Microelectronics (IMAPS), held October 9-11, 2018 in Pasadena, California. He is a Ph.D. student in the Georgia Tech School of Electrical and Computer Engineering (ECE) and is advised by ECE Professor Rao Tummala.
Ravichandran received the award for his paper entitled “Design and Demonstration of 3D Glass Panel Embedded (GPE) Packages for Heterogeneous Integration.” The paper addresses the limitations of current mold-based wafer-level fanout packaging technology by presenting a novel 3D glass-based panel embedded packaging technology to meet the bandwidth, power-efficiency, cost, and reliability requirements of future mobile and high-performance computing applications.
This research was supported by the Industry Consortium at the 3D Systems Packaging Research Center (PRC) at Georgia Tech. Ravichandran, along with his colleagues in the PRC, are developing all of the basic technologies to design and demonstrate 3D GPE packages for a variety of heterogeneous integration applications that include ultra-high bandwidth computing; 5G and millimeter wave communications; MEMS & sensors; IoTs; and flexible, wearable, and low and high-power electronics.
