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There is now a CONTENT FREEZE for Mercury while we switch to a new platform. It began on Friday, March 10 at 6pm and will end on Wednesday, March 15 at noon. No new content can be created during this time, but all material in the system as of the beginning of the freeze will be migrated to the new platform, including users and groups. Functionally the new site is identical to the old one. webteam@gatech.edu
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Title: Theoretical and Experimental Investigations of Connectivity in Three-dimensional Integrated Circuits
Committee:
Dr. Muhannad Bakir, ECE, Chair , Advisor
Dr. Azad Naeemi, ECE
Dr. Jeffrey Davis, ECE
Dr. Tushar Krishna, ECE
Dr. Yogendra Joshi, ME
Abstract:
Three-dimensional integration, in which integrated circuits (ICs) are stacked directly atop one another to reduce interconnect length, is an attractive method for achieving continued performance and efficiency improvements as conventional 2D scaling slows. Significant uncertainty remains, however, about the best methods and designs to adopt for optimal system performance and energy efficiency. In order to address these questions, we present improved interconnect and system-level models for 3D IC performance, as well as experimental investigations into potential thermal limits to the stacking of high performance components. Improved modeling methods for ultra-densely-interconnected systems will also be discussed, in order to quantify the performance impacts of restricted connectivity on complex systems.
