*********************************
There is now a CONTENT FREEZE for Mercury while we switch to a new platform. It began on Friday, March 10 at 6pm and will end on Wednesday, March 15 at noon. No new content can be created during this time, but all material in the system as of the beginning of the freeze will be migrated to the new platform, including users and groups. Functionally the new site is identical to the old one. webteam@gatech.edu
*********************************
Summary Sentence: Excitement around 3D printing continues full speed ahead whether in electronics, consumer goods or industrial systems.
Full Summary: Excitement around 3D printing continues full speed ahead whether in electronics, consumer goods or industrial systems.
SMTA March 8 speaker
SMTA student flyerExcitement around 3D printing continues full speed ahead whether in electronics, consumer goods or industrial systems. Understanding the capabilities, limitations and most importantly the complexities of 3d printing remains challenging despite significant progress in both equipment and materials. While not a comprehensive tutorial on 3D printing, this presentation introduces the application of 3D printing in electronics prototyping and manufacturing including;
Speaker Biography:
Charles E. Bauer, Ph.D. serves as Senior Managing Director of TechLead Corporation, a technology management company specializing in the electronics packaging, interconnection and assembly industry, as well as Director of the University of Portland’s Global Executive Leadership MBA program. Dr. Bauer focuses in the areas of strategic technology planning, market analysis and business development, particularly in the international arena. Recent foci include an emphasis on medical device applications including sensors and imaging systems.
Combining applications experience in implantable, surgical and diagnostic medical devices with extensive background in design and manufacturing, Dr. Bauer presents a balanced perspective between technology and practical implementation for real world products. With more than 40 years’ experience spanning the range from complex interconnection technologies (printed circuit boards, hybrid and IC metallization and fabrication) through complex packaging (multichip modules, system in package, 3D packaging) and assembly (die attach, wire bonding, flip chip, etc.) as well as nano-technology applications in electronics manufacturing, his publications exceed 250 papers, articles and columns. He lectures throughout the world on technology, business and market topics as well as serving on several corporate boards and international corporate, government and educational institution advisory councils.
A Senior Member of IEEE, he remains active in the SMTA, JIEP, ASM and IMAPS Europe as well. Dr. Bauer served on the Boards of both the SMTA and IMAPS and as President of IMAPS in 2001-2002. Awards received include Tektronix Technical Innovation Award, Fellow of IMAPS, the International Leadership Award from the SMTA, Jesuit High School Hall of Fame, University of Portland Significant 75 Alumni and SMTA 25th Anniversary Luminary as founder of the Pan Pacific Microelectronics Symposium.
