Bakir Appointed as Editor-in-Chief for IEEE CPMT Journal

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Jackie Nemeth

School of Electrical and Computer Engineering

404-894-2906

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Summaries

Summary Sentence:

ECE Professor Muhannad S. Bakir has been appointed as the editor-in-chief for the Electronics Manufacturing section of the IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Summary:

ECE Professor Muhannad S. Bakir has been appointed as the editor-in-chief for the Electronics Manufacturing section of the IEEE Transactions on Components, Packaging, and Manufacturing Technology.

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  • Muhannad Bakir Muhannad Bakir
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Muhannad S. Bakir has been appointed as the editor-in-chief for the Electronics Manufacturing section of the IEEE Transactions on Components, Packaging, and Manufacturing Technology (CPMT). This publication is the flagship journal for matters related to advanced packaging, 2.5D and 3D integrated circuit technologies, and heterogeneous integration.  

A professor in the Georgia Tech School of Electrical and Computer Engineering (ECE), Bakir is a past recipient of the IEEE CPMT Outstanding Young Engineer Award and is currently an IEEE CPMT Distinguished Lecturer. He leads the Integrated 3D Systems Group and is a member of the Georgia Tech Center for Co-design of Chip, Package, System (C3PS).

Bakir has been on the ECE faculty since 2010, and prior to that time, he was a research engineer in the Microelectronics Research Center and the Nanotechnology Research Center from 2003-2010. 

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School of Electrical and Computer Engineering

Categories
Institute and Campus, Alumni, Student and Faculty, Research, Engineering, Nanotechnology and Nanoscience, Physics and Physical Sciences
Related Core Research Areas
Electronics and Nanotechnology
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Keywords
IEEE Transactions on Components, packaging, and Manufacturing Technology, integrated circuits, Nanotechnology Research Center, Microelectronics Research Center, Georgia Tech, School of Electrical and Computer Engineering, Muhannad S. Bakir, Integrated 3D Systems Group; Center for Co-design of Chip, package, System;
Status
  • Created By: Jackie Nemeth
  • Workflow Status: Published
  • Created On: Nov 8, 2017 - 2:09pm
  • Last Updated: Nov 8, 2017 - 2:09pm