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There is now a CONTENT FREEZE for Mercury while we switch to a new platform. It began on Friday, March 10 at 6pm and will end on Wednesday, March 15 at noon. No new content can be created during this time, but all material in the system as of the beginning of the freeze will be migrated to the new platform, including users and groups. Functionally the new site is identical to the old one. webteam@gatech.edu
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Atlanta, GA | Posted: July 20, 2017
Jackie Nemeth
School of Electrical and Computer Engineering
404-894-2906
Summary Sentence:
Georgia Tech Ph.D. student Shreya Dwarakanath won the Best of Track (Advanced Packaging) & Best Student Paper awards at the 49th International Symposium on Microelectronics (IMAPS), held October 10-13, 2016 in Pasadena, California.
Full Summary:
Georgia Tech Ph.D. student Shreya Dwarakanath won the Best of Track (Advanced Packaging) & Best Student Paper awards at the 49th International Symposium on Microelectronics (IMAPS), held October 10-13, 2016 in Pasadena, California.
Shreya DwarakanathShreya Dwarakanath won the Best of Track (Advanced Packaging) & Best Student Paper awards at the 49th International Symposium on Microelectronics (IMAPS), held October 10-13, 2016 in Pasadena, California.
Dwarakanath received the award for her paper entitled “Electrodeposited copper-graphite composites for low-CTE integrated thermal structures.” As an award winner, she is invited to attend the IMAPS 2017 Symposium in Raleigh, North Carolina, where she will receive her award. Dwarakanath is a Ph.D. student in the Georgia Tech School of Materials Science and Engineering, and she is advised Professor Rao R. Tummala and mentored by Senior Research Engineer Raj M. Pulugurtha, both of Tech’s School of Electrical and Computer Engineering.
Emerging high-power and high-temperature electronic modules require thick copper (Cu) structures for power-supply, thermal vias, heat-spreaders, and also as carriers or lead-frames for high-power packages. Such structures should coexist with glass and other low-CTE substrates to meet high-temperature performance, dimensional stability, and superior device interconnection reliability with low stresses and warpage. The primary challenge with these packages arises from the coefficient of thermal expansion (CTE) mismatch between the conductors and the substrates.
In order to address this challenge, Cu-graphite composites with glass-matched CTE were explored through analytical modeling of properties such as CTE, Young’s modulus and thermal conductivity, FEM predictions of glass warpage and stresses, process development to deposit copper-graphite composite films with high graphite loading, and warpage measurements using shadow-moiré. Results indicate that Cu-graphite composites can mitigate the warpage and stress issues in high-temperature and high-power packages.
