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Title: System in Package Approach to Efficient 1 GHz Wireless Power Transfer Solution for the Internet of Things Edge Devices
Committee:
Dr. Swaminathan, Advisor
Dr. Wang, Chair
Dr. Mukhopadhyay
Abstract:
The objective of the proposed research is the demonstration of a system in package power delivery solution for (Internet of Things) IoT edge devices based on wireless power transfer (WPT). Two different SIP implementations are proposed. One implementation utilizes a custom 130 nm process DC-DC converter chip and embedded capacitors with complex IoT edge device load needing multiple voltage levels on demand in an area efficient design. The other utilizes commercial DC-DC converters with tuned voltage and power levels for optimal efficiency. Both implementations need all subsystems optimally integrated in the SIP design for maximum performance, verified through comprehensive measurement characterization. Both implementations have WPT coils utilizing near field resonant inductive coupling. The coil geometry will be optimized for power efficiency and size at 1 GHz and 100 mW input power, using both a distributed capacitance approach and a high inductance density approach. An RF-DC conversion stage will examine both full wave and class E diode rectification for suitability in an IoT architecture at 1 GHz. Integration challenges with the WPT coils, RF-DC conversion, and DC-DC converter exist due to the different frequency domains and impedance mismatch. These challenges are identified with a solution explored through the use of parallel capacitance branches. Area efficient and low loss embedded power inductors with magnetic layers are demonstrated with novel, simple fabrication process on FR4 with screen printed double magnetic layer. The measured embedded power inductor characteristics have low inductors losses in an IoT architecture.
