FUTURECAR: New Era of Automotive Electronics Workshop

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Event Details
Contact

Karen May
(404) 385-1220 
karen.may@ece.gatech.edu 
351 MaRC

Summaries

Summary Sentence: Georgia Tech launches Industry Consortium to address challenges in the emerging automotive electronics such as autonomous driving, all-electric cars, high power and high-temperature electronics.

Full Summary: New era of automotive electronics is the most complex electronics technology to date that includes not only computing and communications electronics, autonomous driving electronics, sensing electronics but also high-power and high-temperature electronics. They are expected to account for a third of the value of the car, thus creating a market of ~$1T within a decade. The challenges to address this market may be grouped into two broad categories: 1) research and development of key technologies, and 2) technology ecosystem stewardship to enable swift and cost-efficient commercialization. The basis of this workshop is the synergy between Georgia Tech in R&D in partnership with its 50 supply-chain companies and SEMI in technology stewardship. This is complemented by the strength of co-sponsors such as iNEMI in roadmaps, and IEEE-CPMT and IMAPS as global electronics societies. Drivers of the Future Car Electronics

  • Autonomous driving for improved safety
  • Secure, high-speed streaming communications and infotainment
  • Electric cars needing high-density batteries, high-power and high-temperature electronics.
Consumer expectations will accelerate these drivers requiring the exploration and integration of many disparate and disruptive technologies. This, in turn, will require new models of collaboration across the supply-chain. FUTURECAR: The New Era of Automotive Electronics Workshop will help build these models through technology, business and supply-chain and end-user sessions as well as networking and creative interactions.

Media
  • Automotive drawing Automotive drawing
    (image/jpeg)

Georgia Tech PRC currently has a large industry consortium involving about 50 global supply chain manufacturing and user companies from the U.S., Europe, Japan, Korea and Taiwan. Its current focus is in digital, RF, Power and Photonics – all enabled by its leading-edge research in 11 core areas that include: 1) electrical, mechanical and thermal design, 2) nano and micro materials, 3) devices, 4) electronic substrates, 5) photonic substrates, 6) high-temp electronics, 7) power electronics, 8) sensing electronics, 9) RF and mm-wave electronics, 10) EMI design and materials, and 11) interconnections and assembly.

Georgia Tech automotive industry partners include BMW, GM and Ford, to date. Additional R&D collaborations are underway with Mercedes Benz, Ferrari, Honda, and Toyota in many areas that include hybrid vehicle R&D, internal component design, communication-vehicle interactions, automated driving, driver-assist, human-robot interactions and in environmental impacts.

Current automotive-related faculty expertise at Georgia Tech include:

  • Advanced MEMS and Sensors for Automotive Systems – Prof. Klaus Wolter
  • Sensor Arrays for Media Sensing – Prof. Peter Hesketh
  • Reliability, Prognostic and Condition Monitoring – Prof. Suresh Sitaraman 
  • WBG Power Devices and Modules – Prof. Russ Dupuis
  • High-temperature Drivers – Prof. John Cressler
  • 5G Design – Prof. Manos Tentzeria
  • Thermal Management – Prof. Yogendra Joshi and Prof. Samuel Graham
  • High-temperature Molding Materials – Prof. CP Wong
  • High-bandwidth Photonics – Prof. GK Chang
  • Glass-based Digital Packages – Dr. Venky Sundaram
  • RF and Power components and modules – Dr. Raj Pulugurtha
  • Cu Interconnections Without Solders – Dr. Vanessa Smet
  • Integrated Systems – Prof. Rao Tummala

R&D projects and Industry Consortium partnerships will be covered.

Additional Information

In Campus Calendar
Yes
Groups

3D Systems Packaging Research Center, College of Engineering, Institute for Electronics and Nanotechnology

Invited Audience
Faculty/Staff, Public
Categories
Seminar/Lecture/Colloquium, Training/Workshop
Keywords
3D Packaging, Automotive Electronics, PRC
Status
  • Created By: Karen May
  • Workflow Status: Error
  • Created On: Jan 31, 2017 - 12:56pm
  • Last Updated: Jan 31, 2017 - 12:56pm