RDL demonstration with 2.5µm line and 2.5µm via line by embedded trench/via process in photo-sensitive IF 4600 dry films from TOK Japan.

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RDL demonstration with 2.5µm line and 2.5µm via line by embedded trench/via process in photo-sensitive IF 4600 dry films from TOK Japan.

No description available

Additional Information

Groups

3D Systems Packaging Research Center, College of Engineering, Institute for Electronics and Nanotechnology

Categories
Institute and Campus, Student and Faculty, Student Research, Engineering, Nanotechnology and Nanoscience
Keywords
RDL, embedded trench process, dry films, Packaging Research Center
Status
  • Created By: Karen May
  • Workflow Status: Draft
  • Created On: Dec 5, 2016 - 10:54am
  • Last Updated: Dec 5, 2016 - 10:54am