Multi-layer RDL demonstration with 2.5µm lines and 10µm vias by excimer laser ablation by Suss Microtech and SAP process at Georgia Tech.

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Multi-layer RDL demonstration with 2.5µm lines and 10µm vias by excimer laser ablation by Suss Microtech and SAP process at Georgia Tech.

No description available

Additional Information

Groups

3D Systems Packaging Research Center, College of Engineering, Institute for Electronics and Nanotechnology

Categories
Institute and Campus, Student and Faculty, Student Research, Engineering, Nanotechnology and Nanoscience
Keywords
multi-layer RDL, eximer laser ablation, Packaging Research Center
Status
  • Created By: Karen May
  • Workflow Status: Draft
  • Created On: Dec 5, 2016 - 10:52am
  • Last Updated: Dec 5, 2016 - 10:52am