Advanced high-temperature epoxy molding compound structure for improved thermal stability, thermal dissipation, fracture toughness and mechanical reliability, at Georgia Tech.

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Advanced high-temperature epoxy molding compound structure for improved thermal stability, thermal dissipation, fracture toughness and mechanical reliability, at Georgia Tech.

No description available

Additional Information

Groups

3D Systems Packaging Research Center, College of Engineering, Institute for Electronics and Nanotechnology

Categories
Student and Faculty, Student Research, Engineering
Keywords
molding compounds, expoxy molding
Status
  • Created By: Karen May
  • Workflow Status: Published
  • Created On: Nov 21, 2016 - 9:23am
  • Last Updated: Nov 21, 2016 - 9:24am