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There is now a CONTENT FREEZE for Mercury while we switch to a new platform. It began on Friday, March 10 at 6pm and will end on Wednesday, March 15 at noon. No new content can be created during this time, but all material in the system as of the beginning of the freeze will be migrated to the new platform, including users and groups. Functionally the new site is identical to the old one. webteam@gatech.edu
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Atlanta, GA | Posted: June 30, 2016
Summary Sentence:
The Georgia Institute of Technology, School of Electrical and Computer Engineering Professor, Dr. Rao Tummala, will present a keynote lecture at the 2016 International Wafer-Level Packaging Conference (IWLPC), on October 19 in San Jose, CA.
Full Summary:
No summary paragraph submitted.
Rao TummalaThe SMTA and Chip Scale Review magazine have announced that The Georgia Institute of Technology, School of Electrical and Computer Engineering Professor, Dr. Rao Tummala, will present a keynote lecture at the 2016 International Wafer-Level Packaging Conference (IWLPC), on October 19 in San Jose, CA.
Titled "Promise and Future of Embedding and Fan-Out Technologies,” Prof. Tummala’s speech will touch upon the two types packaging strategies, wafer-level packaging (WLP) with embedded ICs with limited external I/O connections, and fan-out technology (eWLP) that eliminates these I/O limitations. He will also talk about two other alternatives such as panel level fan out with chip-first and chip-last options. This presentation will describe the promise and future of embedding and fan-out technologies in relation to package size, thickness, interconnect length, I'O pitch and production costs.
Prof. Rao Tummala is a Distinguished and Endowed Professor Chair at Georgia Tech. He is well known as an industrial technologist, technology pioneer, and educator. He is the father of LTCC and many System-on-Package Technologies.
Interconnecting Wafer-Level packaging, 3D, and manufacturing, the International Wafer-Level Packaging Conference (IWLPC) has been at the forefront of packaging technology evolution. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. More about the conference here
- Christa Ernst
