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There is now a CONTENT FREEZE for Mercury while we switch to a new platform. It began on Friday, March 10 at 6pm and will end on Wednesday, March 15 at noon. No new content can be created during this time, but all material in the system as of the beginning of the freeze will be migrated to the new platform, including users and groups. Functionally the new site is identical to the old one. webteam@gatech.edu
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MSE PhD Defense – Xian Qin
Date: 3/10/2015
Time: 2:00pm-4:00pm
Location: MaRC 201
Committee:
Prof. Rao Tummala (Advisor,MSE)
Prof. Preet Singh (MSE)
Prof. Richard Neu (MSE)
Prof. Suresh Sitaraman (ME)
Dr. P. Markondeya Raj (MSE)
Title: Compliant copper microwire array interconnections for direct attach of large low-CTE packages to printed wiring boards
Abstract:
The proposed study addresses the thermomechanical reliability challenges for board-level interconnections between large low-CTE packages and organic printed wiring board. Low-CTE packages, such as silicon, glass and low-CTE organic materials, have outstanding dimensional stability and allow for precise alignment from layer to layer with small vias. This enables high interconnection density on the package level. However, the CTE mismatch between the package and the board, induces grand reliability challenges for traditional lead-free solder interconnections.
This study proposes compliant copper microwire arrays for reliable board-level interconnections. The modeling, design, fabrication and validation of the microwire array interconnections will be demonstrated. The proposed study provides a highly reliable and SMT compatible interconnection solution, and enables the advanced low-CTE packages for the next-generation electronic systems.
