Neural Engineering Center Seminar

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Event Details
  • Date/Time:
    • Friday October 31, 2014 - Saturday November 1, 2014
      12:00 pm - 12:59 pm
  • Location: Whitaker Building, Room 1214
  • Phone:
  • URL: http://www.bme.gatech.edu
  • Email:
  • Fee(s):
    N/A
  • Extras:
Contact

Faculty Host: Robert Butera, Ph.D.

Trainee Host: Yogi Patel

Summaries

Summary Sentence: "Softening Polymer Substrates for Chronically Soft Neural Interfaces" - Walter Voit, PhD - University of Texas at Dallas

Full Summary: No summary paragraph submitted.

Media
  • Walter Voit, PhD - University of Texas at Dallas Walter Voit, PhD - University of Texas at Dallas
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  • Neural Engineering Center Seminar Neural Engineering Center Seminar
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Related Files

"Softening Polymer Substrates for Chronically Soft Neural Interfaces"

Walter Voit, PhD
Assistant Professor of Mechanical Engineering
Material Science & Engineering
University of Texas at Dallas

We describe smart engineered shape memory polymer (SMP) substrates, which have been proposed for use in biomedical devices extensively over the past decade. Specifically, the paradigm of softening bioelectronics medicines enables devices such as neural interfaces to be implanted while mechanically rigid and subsequently soften in physiological conditions. Harris et al. have demonstrated softening intracortical electrodes based on the significant swelling of thermally and water sensitive polymer substrates. Building upon this work, we have further demonstrated the fabrication, characterization and demonstration of softening neural interfaces with 5 micron minimum feature sizes patterned using full-­‐photolithography reaching temperature up to 85°C on softening substrates with minimal swelling. SMP substrates are thiol-­‐ ene/acrylate copolymers designed to position the glass transition temperature (Tg) to near 55°C, such that after plasticization in fluid, the Tg shifts 20°C triggering softening. This paradigm allows surgeons adequate time for implantation, and maintains sub 3% swelling of the substrate to minimize abiotic device failure and delamination of the patterned Parylene-­‐C barrier coating. We balance mechanical buckling forces, created by modulus mismatches between the device modulus at insertion and that of both agarose gel (in vitro experimental model) and the cortex of a laboratory rat. Other studies have shown how higher modulus materials, such as silicon, tungsten, Parylene-­‐C and polyimides maintain sufficient stiffness to allow implantation into tissue. Our devices match these supra 1 GPa insertion properties, but chronically behave mechanically more similarly to polydimethylsiloxane.

Faculty Host: Robert Butera, Ph.D.

Trainee Host: Yogi Patel

 

Related Links

Additional Information

In Campus Calendar
No
Groups

Wallace H. Coulter Dept. of Biomedical Engineering

Invited Audience
Undergraduate students, Faculty/Staff, Graduate students
Categories
Seminar/Lecture/Colloquium
Keywords
BME, IBB, seminar
Status
  • Created By: Chris Calleri
  • Workflow Status: Published
  • Created On: Oct 20, 2014 - 11:31am
  • Last Updated: Apr 13, 2017 - 5:21pm