IEN Technical Seminar on Advanced Fabrication: Interconnects, System Integration, and Packaging of Electronics

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Event Details
  • Date/Time:
    • Thursday August 21, 2014 - Friday August 22, 2014
      12:00 pm - 12:59 pm
  • Location: Marcus Nanotechnology Building Conference Room 1116 | 345 Ferst Drive | Atlanta, GA 30332
  • Phone: (404) 894-5100
  • URL: http://www.ien.gatech.edu
  • Email: info@ien.gatech.edu
  • Fee(s):
    N/A
  • Extras:
Contact

Hang Chen: hang.gatech@gmail.com

 

Summaries

Summary Sentence: Join GT-IEN for a lecture with ECE Professor M. Bakir on the past and future of electronic systems integration and system interconnection methods.

Full Summary: No summary paragraph submitted.

Media
  • Professor Muhannad S. Bakir Professor Muhannad S. Bakir
    (image/jpeg)

Abstract: This presentation will provide a retrospect and prospects for electronics interconnects, system integration, and packaging.

Biography: Muhannad S. Bakir received his B.E.E. degree (Summa Cum Laude) from Auburn University, Auburn, AL, in 1999 and his M.S. and Ph.D. degrees in electrical and computer engineering from the Georgia Institute of Technology in 2000 and 2003, respectively.

Bakir is currently an Associate Professor and the ON Semiconductor Junior Professor in the School of Electrical and Computer Engineering at Georgia Tech. His areas of interest include three-dimensional (3D) electronic system integration, advanced cooling and power delivery for 3D systems, heterogeneous system interconnection, biosensors and their integration with CMOS circuitry, and nanofabrication technology. Bakir is the editor of a book entitled Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Artech House, 2009; with James D. Meindl) and is the author/coauthor of more than 110 journal publications and conference proceedings, 6 book chapters, 14 US patents, multiple invited presentations, and the presenter of 2 conference tutorials, including an invited tutorial on 3D technology at the 2007 International Solid-State Circuits Conference (ISSCC).

Professor Bakir is the recipient of the 2013 Intel Early Career Faculty Honor Award; 2012 DARPA Young Faculty Award; 2011 IEEE CPMT Society Outstanding Young Engineer Award; and was an Invited Participant in the 2012 National Academy of Engineering Frontiers of Engineering Symposium. Bakir and his research group have received fourteen conference and student paper awards, including five awards from the IEEE Electronic Components and Technology Conference (ECTC), four awards from the IEEE International Interconnect Technology Conference (IITC), and one award from the IEEE Custom Integrated Circuits Conference (CICC).

 

Additional Information

In Campus Calendar
Yes
Groups

NanoTECH, Institute for Electronics and Nanotechnology, Georgia Electronic Design Center (GEDC), The Center for MEMS and Microsystems Technologies, 3D Systems Packaging Research Center

Invited Audience
Undergraduate students, Faculty/Staff, Public, Graduate students
Categories
Seminar/Lecture/Colloquium
Keywords
Electronics Packaging, Institute for Electronics and Nanotechnology, interconnections, lecture, Muhannad S. Bakir, School of Electrical and Computer Engineeering, system integration
Status
  • Created By: Christa Ernst
  • Workflow Status: Published
  • Created On: Aug 13, 2014 - 6:50am
  • Last Updated: Apr 13, 2017 - 5:22pm