4th Annual Global Interposer Technology (GIT) Workshop

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Event Details
  • Dates/Times:
    • Wednesday November 5, 2014 - Thursday November 6, 2014
      1:00 pm - 5:59 pm
    • Thursday November 6, 2014 - Friday November 7, 2014
      1:00 pm - 5:59 pm
    • Friday November 7, 2014 - Saturday November 8, 2014
      1:00 pm - 5:59 pm
    • Saturday November 8, 2014 - Sunday November 9, 2014
      1:00 pm - 5:59 pm
  • Location: Global Learning Center at the Georgia Institute of Technology | 84 Fifth Street, NW | Atlanta, Georgia 30332 USA
  • Phone: (404) 894-9097
  • URL: http://www.prc.gatech.edu/git2014
  • Email: karen.may@ece.gatech.edu
  • Fee(s):
    Fee Varies
  • Extras:
Contact

Karen May: karen.may@ece.gatech.edu
404.385.1220

Summaries

Summary Sentence: GIT 2014 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies that supply materials and tools from around the world.

Full Summary: No summary paragraph submitted.

Media
  • GIT 2014 Prelim Program GIT 2014 Prelim Program
    (image/jpeg)

4th Annual Global Interposer Technology (GIT) Workshop

Wednesday, November 5th – Friday, November 7th

Global Learning Center at the Georgia Institute of Technology
84 Fifth Street, NW Atlanta, Georgia 30332 USA

 The GIT 2014 Workshop is intended to stimulate development of most advanced semiconductor and systems packaging technologies, comparing and contrasting a wide variety of interposer and package technologies being developed such as silicon, organic, and glass. GIT 2014 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies that supply materials and tools from around the world. Such interposer and package technologies have many applications including packaging of ICs in 2D, 2.5D and 3D for smart and wearable, automotive, and high performance systems.

Plenary Panel Session: Interposer Technologies and Manufacturing Infrastructure

GIT 2014 Technical Sessions

  • Glass Interposers
  • System Integration with Interposers
  • Panel Mfg. Infrastructure – Tools and Materials
  • Design and Design Tools: Electrical, Thermal, and Mechanical Design
  • Organic and WLFO Interposers 
  • Interposers for RF and Power

Over 38 guest lecturers from all sectors of the packaging supply chain.

Keynote and Invited Speakers include:

  • Daniel Berger, IBM
  • D.C. Hu, Unimicron
  • M. Okuyama NGK NTK
  • M. Gingerella, SUSS
  • Reona Nakamura, Mitsubishi Electric
  • R. Sprengard, SCHOTT
  • F. Carbolante, Qualcomm
  • And many others

GIT 2014 will close with the GIT Golf Classic
Saturday, November 8th, Reynolds Plantation Greensboro, Georgia  30642 USA

 

Additional Information

In Campus Calendar
Yes
Groups

NanoTECH, Institute for Electronics and Nanotechnology, Georgia Electronic Design Center (GEDC), The Center for MEMS and Microsystems Technologies, 3D Systems Packaging Research Center

Invited Audience
Undergraduate students, Faculty/Staff, Public, Graduate students
Categories
Conference/Symposium, Seminar/Lecture/Colloquium
Keywords
3D Systems Packaging Research Center, GIT 2014, Global Interposer Workshop, Institute for Electronics and Nanotechnology, packaging technologies, Rao Tummala
Status
  • Created By: Christa Ernst
  • Workflow Status: Published
  • Created On: Jul 28, 2014 - 9:28am
  • Last Updated: Apr 13, 2017 - 5:22pm