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Speaker: Kamal K. Samanta
Affiliation: Senior Principal Engineer & Project Manager – Milmega/Teseq, UK; Consultant: Thales Aerospave & Defense, UK
Topic: “Next Generation Multilayer Substrate Integrated Waveguides and Highly Integrated Circuits at Millimetre-Wave and Beyond”
Abstract
To make the advanced applications of millimeter-wave (mmW) feasible, a variety of multichip module (MCM/SoP) technologies are being developed for realizing compact RF frontends at a low cost. For mm-wave and sub-mmW circuits, the loss in the planar transmission lines increases. However, substrate integrated waveguide (SIW) comes out as an extremely capable due to its simple fabrication process and ease of integration with MMIC/MICs. The SIW is being realized using various technologies. Unfortunately, most of these circuit technologies employ rows of via holes (fence-post), which starts to become too close together for high frequency operation. At the same time, on conventional thick-film, it is very difficult to achieve fine conductor geometry for next generation compact passive/lumped components with high self-resonance-frequency (SRF). To
address the lack of dimensional precision, as well as via resolution at high frequency, advanced multilayer thick-film photoimageable technology is found to be very promising. The technology is highly suitable to produce multilayer SIW giving operation to 180 GHz and beyond, and to realize fine conductor geometry (10/15 μm), enabling the realization of precisely defined passive
components and modules with remarkably high performance and miniaturization.
The talk will introduce the audience with the advanced ceramic-based multilayer thick-film MCM technology, which uses a very straightforward and cost-effective fabrication process. Then we shall present the design of a wide range of Mw and mmW multilayer SIW and other passive components and circuits, and the performances will be shown better than most of the reported results from conventional MCMs. Finally, we shall discuss on the novel mounting/integration techniques and the tested result for mmW modules, including that for a highly compact complete mm-wave (V-band) receiver integrating SIW components with MMICs and other passives into a single substrate.
Biography
Kamal K. Samanta graduated in Science (Phy) and Engineering (Electron.) before his double Masters in Eng. and Management. He received his B.Tech and M.Tech degree from the Calcutta University, India, and his PhD from the University of Leeds, England. For about two decades, he has been extensively involved in the industrial research, development and manufacture of RF to millimetre wave (MHz to 180 GHz; power to MW) circuits and systems. His roles have included that of Sr. Principal/Principal R&D Engineer, Scientist and Consultant. Current research interests include development of novel microwave to sub-mmW circuits (MIC/MMIC), multilayer passives, cost-effective multichip modules (MCM) and system-on-package (SoP) modules and technologies.
