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There is now a CONTENT FREEZE for Mercury while we switch to a new platform. It began on Friday, March 10 at 6pm and will end on Wednesday, March 15 at noon. No new content can be created during this time, but all material in the system as of the beginning of the freeze will be migrated to the new platform, including users and groups. Functionally the new site is identical to the old one. webteam@gatech.edu
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Atlanta, GA | Posted: February 21, 2014
The 3-D Systems Packaging Research Center at Georgia Tech is pleased to announce the important dates for the 2014 Global Interposer Technology Workshop, to be held at the Global Learning Center November 5th - 7th, 2014, and the GIT 2nd Annual Golf Classic at Reynolds Plantation November 8th, 2014.
The GIT 2014 Workshop is intended to explore and stimulate the development of advanced semiconductor and systems packaging technologies, comparing and contrasting a wide variety of interposer and package technologies being developed such as silicon, organic, and glass based approaches. GIT 2014 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies that supply materials and tools from around the world. Such interposer and package technologies have many applications including packaging of ICs in 2D, 2.5D and 3D for smart and wearable, automotive, and high performance systems.
Important Dates
For more information contact Karen May at 404-385-1220, karen.may@prc.gatech.edu