Professor Rao Tummala's Viewpoint on Packaging and System Scaling

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External News Details

Rao R Tummala, Pettit Chair Professor and Director, Georgia Tech

We started packaging because of the need  to test the chips and to connect with other components on the system board to form electronic systems. So transistor scaling, following Moore's Law, was the basis of packaging and  all electronics, making  electronics the single largest, $1.5T, global industry serving a variety of individual industries that span computing, communications, consumer, automotive and others.

The basis for this industry is a result of singular focus in transistor scaling, leading to a 5B transistor chip, involving dozens of semiconductor companies around the globe.These chips were packaged mostly as single chips, in which case the value of packaging has been minimal.

To read more of this viewpoint follow this link: http://www.semiconductorpackagingnews.com/articles/article_44712.shtml

Additional Information

Groups

Institute for Electronics and Nanotechnology, 3D Systems Packaging Research Center

Categories
Engineering, Nanotechnology and Nanoscience, Research
Keywords
3D Systems Packaging Research Center, Institute for Electronics and Nanotechnology, packaging technologies, Rao Tummala, system scaling
Status
  • Created By: Christa Ernst
  • Workflow Status: Published
  • Created On: Jan 17, 2014 - 9:05am
  • Last Updated: Oct 7, 2016 - 10:26pm