Global Interposer Technology Workshop (GIT 2013)

*********************************
There is now a CONTENT FREEZE for Mercury while we switch to a new platform. It began on Friday, March 10 at 6pm and will end on Wednesday, March 15 at noon. No new content can be created during this time, but all material in the system as of the beginning of the freeze will be migrated to the new platform, including users and groups. Functionally the new site is identical to the old one. webteam@gatech.edu
*********************************

Event Details
Contact
No contact information submitted.
Summaries

Summary Sentence: Global Semiconductor and System Technology Leaders to Debate Future of Electronics for Smart Systems, R&D and Manufacturing at GIT 2013

Full Summary: GIT 2013 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies from around the world. These leading-edge interposer technologies have many applications including in the packaging of ICs in 2D, 2.5D and 3D from smart phones, automotive and high performance systems.

Media
  • GIT 2013 Logo Sm GIT 2013 Logo Sm
    (image/jpeg)

You are cordially invited to the GIT 2013 Workshop, which is intended to stimulate the development of the most advanced semiconductor and systems packaging technologies, with interposer experts comparing and contrasting a wide variety of interposer technologies such as silicon, organic, and glass.

GIT 2013 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies from around the world. These leading-edge interposer technologies have many applications including in the packaging of ICs in 2D, 2.5D and 3D from smart phones, automotive and high performance systems.

GIT 2013 will focus on Interposer Technology with an expanded 2 1/2-day agenda including:

* Plenary Talks from Industry and Academic Experts

* Technical Sessions and Talks on

  • High Performance & Mobil Systems
  • Silicon Interposers: Foundry, OSAT and Research
  • Organic Interposers and Packages: User, Manufacturer, Research and Supply Chain Perspectives
  • Glass Interposers and Interconnections: Research, Application, Manufacturing Perspective
  • Glass Panel Manufacturing and Glass Interposer Manufacturing Instructure
  • Analog and Embeddded Packaging
  • Design: Electrical, Thermal and Mechanical
  • Markets and Applications

* Interactive Poster Session (Best Poster Paper Awards)

* Networking opportunities with more than 150 System Packaging and Technology Experts

* GIT 2013 Grand Reception - Historic Academy of Medicine

GIT 2013 Kicks off Sunday, November 17 with The 1st Annual GIT Golf Classic at The Landing Course, Reynolds Plantation, Greensboro, Georgia, "The Landing is the hidden gem of Lake Oconee. Bob Cupp's architectural genius was unveiled to the golfing world during the construction of Reynolds Landing. From the masterful green settings to the challenging shots played around beautiful Lake Oconee, The Landing is clearly one of Georgia's finest kept secrets."

Costs include: Transportation to and from the Georgia Tech Learning Center, greens fees, timed starts, and brunch. Best ball and longest drive awards will be recognized for the day!

Additional Information

In Campus Calendar
Yes
Groups

Institute for Electronics and Nanotechnology, Georgia Electronic Design Center (GEDC)

Invited Audience
No audiences were selected.
Categories
Conference/Symposium, Seminar/Lecture/Colloquium, Training/Workshop
Keywords
3D Systems Packaging Research Center, GIT 2013, glass packaging, Interposers, organic semiconductors, silicon wafer
Status
  • Created By: Christa Ernst
  • Workflow Status: Published
  • Created On: Oct 15, 2013 - 11:37am
  • Last Updated: Oct 7, 2016 - 10:05pm