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There is now a CONTENT FREEZE for Mercury while we switch to a new platform. It began on Friday, March 10 at 6pm and will end on Wednesday, March 15 at noon. No new content can be created during this time, but all material in the system as of the beginning of the freeze will be migrated to the new platform, including users and groups. Functionally the new site is identical to the old one. webteam@gatech.edu
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Large, low-TCE packages are required in both high-performance, as 2.5D packages in sizes as large as 60 mm and with lithographic ground rules below 5 microns, as well as in consumer electronics. These low-TCE packages are also needed to avoid stress on the ultra-low k dielectrics within the chip, as they tend to be fragile. Low-TCE packages are required in modern consumer applications to minimize thickness.
Read the entire research report at Chip Scale Review online.
