Global Semiconductor and System Technology Leaders to Debate Future of Electronics for Smart Systems, R&D and Manufacturing at GIT 2013 - November 18-20

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Summaries

Summary Sentence:

The Global Interposer Technology 2013 Workshop (GIT 2013), sponsored by IEEE, brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies from around the world.

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You are cordially invited to the GIT 2013 Workshop, sponsored by IEEE, is intended to stimulate the development of the most advanced semiconductor and systems packaging technologies, with interposer experts comparing and contrasting a wide variety of interposer technologies such as silicon, organic, and glass.

GIT 2013 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies from around the world. These leading-edge interposer technologies have many applications including in the packaging of ICs in 2D, 2.5D and 3D from smart phones, automotive and high performance systems.

GIT 2013 will focus on Interposer Technology with an expanded 2 1/2-day agenda including:

* Plenary Talks from Industry and Academic Experts

* Technical Sessions

* Interactive Poster Session (Best Poster Paper Awards)

* Networking Reception

GIT 2013 Kicks off Sunday, November 17 with The 1st Annual GIT Golf Classic at the Landing Course, Reynolds Plantation, Greensboro, Georgia, "The Landing is the hidden gem of Lake Oconee. Bob Cupp's architectural genius was unveiled to the golfing world during the construction of Reynolds Landing. From the masterful green settings to the challenging shots played around beautiful Lake Oconee, The Landing is clearly one of Georgia's finest kept secrets."

Costs include: Transportation to and from the Georgia Tech Learning Center, greens fees, timed starts, and brunch. Best ball and longest drive awards will be recognized for the day!

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Groups

Categories
Institute and Campus, Education, Art Research, Special Events and Guest Speakers, Engineering, Nanotechnology and Nanoscience
Related Core Research Areas
Electronics and Nanotechnology
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Keywords
3D Systems Packaging Research Center, Global Interposer Workshop, IEEE Conference, IEEE Invited Speaker Series, Institute for Electronics and Nanotechnology, interconnections, Interposers, packaging, Semiconductors
Status
  • Created By: Christa Ernst
  • Workflow Status: Published
  • Created On: Oct 14, 2013 - 4:29am
  • Last Updated: Oct 7, 2016 - 11:15pm