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There is now a CONTENT FREEZE for Mercury while we switch to a new platform. It began on Friday, March 10 at 6pm and will end on Wednesday, March 15 at noon. No new content can be created during this time, but all material in the system as of the beginning of the freeze will be migrated to the new platform, including users and groups. Functionally the new site is identical to the old one. webteam@gatech.edu
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Atlanta, GA | Posted: November 6, 2012
Jackie Nemeth
School of Electrical and Computer Engineering
404-894-2906
Summary Sentence:
ECE Ph.D. student Shreepad Panth has received the Padovani Scholarship from Qualcomm.
Full Summary:
ECE Ph.D. student Shreepad Panth has received the Padovani Scholarship from Qualcomm. He is one of seven Qualcomm interns to be chosen for this award.
Shreepad PanthShreepad Panth has received the Padovani Scholarship from Qualcomm. He is one of seven Qualcomm interns to be chosen for this award.
Mr. Panth is a Ph.D. student in the School of Electrical and Computer Engineering at Georgia Tech and is advised by Sung Kyu Lim. He has been working as an intern at Qualcomm in San Diego since May and will return to Georgia Tech at the end of the year. He is one of only seven interns from the entire corporation to receive this award in 2012.
Mr. Panth is a hardware/application-specific integrated circuit (ASIC) intern on Qualcomm's monolithic 3D-IC project, focused on design methodologies. Since 2011, he has been an important contributor to the recently initiated corporate R&D monolithic 3D-IC project. In collaboration with CR&D engineers, Mr. Panth has developed an in-house 2D/3D floorplanning tool and a number of different plug-ins/scripts to enable the existing 2D tools to perform appropriate 3D-related tasks. This entire infrastructure enabled Qualcomm to obtain a working register transfer level-to-post-layout 3D-IC implementation flow for the first time. Additionally, he is currently using the Qualcomm 3D implementation flow to study the power/performance tradeoffs of monolithic 3D-IC designs using different test cases, including an internal modem design. Upon returning to Georgia Tech, he will continue his collaboration with the team to push thermal-aware and gate-level 3D-IC design methodologies.
“Shreepad is creative, articulate and has a truly exceptional work ethic,” said Kambiz Samadi, Mr. Panth's manager at Qualcomm. “He has a great research track record that includes nine publications in top-tier conferences and journals and was a key member of the team that designed and taped out the first 3D massively parallel processor with stacked memory at Georgia Tech [whose work was published and presented at ISSCC 2012].”
